AMAOE MP2 0.12mm Power IC BGA Reballing Stencil for Qualcomm and MediaTek

Name: AMAOE MP2 0.12mm Power IC BGA Reballing Stencil for Qualcomm and MediaTek
Brand: AMAOE
SKU: MP-2
Availability: InStock

₹179.00

Brand: AMAOE

Model: MP-2

Availability: In Stock

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Tags: Power IC Stencil BGA Reballing AMAOE MP2

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Description
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Product Description

The AMAOE MP2 Power IC BGA Reballing Stencil is designed for reballing compatible power management ICs (PMICs) used in Qualcomm and MediaTek mobile devices. Its 0.12mm stencil plate helps technicians apply solder through the matching BGA pad pattern during motherboard repair.

Supported IC Models

PM7250 / PM7250B
PMX55
PM6350 / PM7150A
PM4250 / PM6225
PM7325 / PM7325B / PM7350C
PM8250
PM8350 / PM8350BH / PM8350C
PM8450
MT6359VPP
MT6635XP
MT6365VMW
MT6360P / MT6360MP / MT6360RP

Product Specifications

Brand: AMAOE
Model: MP2
Thickness: 0.12mm
Product Type: Power IC BGA Reballing Stencil
Compatible Platforms: Qualcomm and MediaTek
Application: Power IC solder-ball rework and motherboard repair
Package Contents: 1 × BGA reballing stencil

Important: Check the exact IC marking and compare its BGA layout with the stencil before use. Compatibility depends on the IC package and pad pattern, not just the phone brand or processor platform.

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